Soldering wire | Sn99Ag0,3Cu0,7 | 0.8mm | 100g | lead free | 216÷227°C
Soldering iron: with htg elem | for SP-1011DLR station | 60W
Tip | 325÷358°C | for Thermaltronics DS-KIT-3 desoldering iron
Tip | 420÷475°C | for Thermaltronics DS-KIT-3 desoldering iron
Nozzle: hot air | TSOP-20,TSOP-24 | 17x7.1mm | Similar types: H-TS24
Flux: rosin based | halide-free,non-corrosive,No Clean,ROL0 | pen
Soldering wire | Sn99Ag0,3Cu0,7 | 700um | 100g | lead free | 216÷227°C
Soldering mat | 297x210mm | silicone | Resistance to: temperature
Soldering iron: gas | 1300°C | 7.5ml | 40min | Air flow temp: 450°C
Burner: gas | 5.5ml | 25min | 650°C | Equipment: hot air deflector
Solder paste | lead-based | 179°C | Sn62Pb36Ag2 | 20g | syringe | 5ml
Tip | 350÷398°C | for Thermaltronics DS-KIT-3 desoldering iron

